The high-density, ceramic-based thermal compound specifically designed for modern high-power CPUs and high-performance heatsinks or water-cooling solutions.
Made with micronized aluminum oxide, boron nitride and zinc oxide.
Ceramique uses a high-density layered composite of five unique shapes of thermally conductive aluminum oxide, boron nitride and zinc oxide sub-micron particles to maximize particle-to-particle contact area and thermal transfer. This exclusive combination provides performance exceeding most metal based compounds.
Controlled triple phase viscosity.
Ceramique does not contain any silicone. The suspension fluid is a proprietary mixture of advanced polysynthetic oils that provide superior performance and long-term stability. During the system's initial use, the heat from the CPU lowers the viscosity of the compound to enhance the filling of the microscopic valleys and ensure a minimum bond line between the heatsink and the CPU core. Then the compound thickens slightly over the next 100 to 300 hours of use to its final consistency designed for long-term stability.
Stability: Ceramique is engineered to not separate, run, migrate, or bleed.
Electrical Insulator: Ceramique does not contain any metal or other electrically conductive materials. It is a pure electrical insulator, neither electrically conductive nor capacitive.
Temperature Limits: Peak: – 40°C to > 180°C
Long-Term: – 40°C to 140°C