Cooler Master ThermalFusion 400 High Performance Thermal Compound
ThermalFusion 400 is a supreme thermal compound that includes high thermal conductivity with low thermal resistance. Its non-curing and non-electrical conductive traits can avoid any short circuit incidence. ThermalFusion 400 is the ultimate solution for thermal dissipation to improve CPU, GPU cooling and other bonding applications.
- High Thermal Conductivity
- Low Thermal Resistance
- Easy Application with Included Razor Blade
|BLT (Bond Line Thickness)
||0.032 (degree Celsius-cm2/W)