Enzotech Forged Copper BGA Heatsinks - Low-Profile
Product Description
BCC9 (Bmr-C1L) was a join adventure with a well known Canadian review site bcchardware.com. BCC9 is a refined low profile version of the bmr-c1, with the refined fin height and base thickness, will work with some specific application which has low clearance.
Features:
- ATIŽ & NVIDIAŽ Compatible
- Pure forged copper
- Easy installation by using 3M™ 8815 Thermal Tape
- Multipack - Eight (8) piece set
- Low profile
Specification:
Dimensions (mm) |
14(L) mm x 14mm(W) x 9mm(H) |
Material |
C1100 Forged Copper |
Weight |
5g (Each) |
Thermal Adhesive |
3M™ 8815 Thermal Tape (Datasheet) |